June 3, 2017 – Steven Schon, QuantaCool’s Chief Technology Officer, and Dr. Alfonso Ortega, QuantaCool’s Science and Engineering Advisor, are among the co-authors of a paper presented at the Institute for Electrical and Electronic Engineering (IEEE) ITherm conference held in Orlando, Florida.
The paper is titled “Experiments on the Simultaneous Two-Phase Liquid Cooling of Multiple Simulated Servers at Differing Vertical Rack Positions in Steady State”. It presents the thermal and hydraulic performance for simultaneous 2-phase cooling of several servers using either pumped or passive (thermosyphon) operation. The study used QuantaCool’s proprietary microchannel evaporative cold plates to remove the heat from the devices.
ITherm 2017 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.